台积电开发人工智能芯片封装技术以对抗英特尔
【台积电开发人工智能芯片封装技术以对抗英特尔】金色财经报道，7月30日，据两位直接了解该项目的人士透露，台积电正在开发一种与英特尔现有技术类似的先进芯片封装技术。这表明，这家全球领先的芯片制造商对来自远距离竞争对手的挑战感到担忧。芯片封装是芯片生产的最后阶段，在这个阶段，将各个硅片组装成一个整体，并将它们连接起来，使它们能够作为一个整体工作，并连接到计算机的其他部分。()
| 排名 | # | 交易平台 | 24H成交额 | 成交涨跌幅 | 活跃度 | 交易平台 | 活跃度 |
|---|---|---|---|---|---|---|---|
| 1 | $186.36亿 | -11.12% | 86.7% | 86.7% | |||
| 2 | $26.02亿 | 0.45% | 68.6% | 68.6% | |||
| 3 | $402.86亿 | -8.22% | 85.4% | 85.4% | |||
| 4 | $8.98亿 | -15.4% | 69.3% | 69.3% | |||
| 5 | $110.32亿 | -6.88% | 65.3% | 65.3% | |||
| 6 | $12.45亿 | -8.23% | 53.3% | 53.3% | |||
| 7 | $2.00亿 | 19.45% | 65.3% | 65.3% | |||
| 8 | $7.36亿 | -8.6% | 68.4% | 68.4% | |||
| 9 | $2.86亿 | -20.72% | 56.9% | 56.9% | |||
| 10 | $70.23亿 | 0.51% | 71.1% | 71.1% | |||
| 11 | $4.42亿 | 5.43% | 36.2% | 36.2% | |||
| 12 | $2,998.83万 | -18.61% | 59.5% | 59.5% | |||
| 13 | $214.03亿 | -0.42% | 31% | 31% | |||
| 14 | $112.84亿 | 1.26% | 76.2% | 76.2% | |||
| 15 | $1.45亿 | -9.35% | 66.9% | 66.9% | |||
| 16 | $107.84亿 | -12.11% | 55.2% | 55.2% | |||
| 17 | $11.82亿 | -6.56% | 26% | 26% | |||
| 18 | $16.39亿 | 27.26% | 46.9% | 46.9% | |||
| 19 | $1.11亿 | -10.77% | 31.5% | 31.5% | |||
| 20 | $1,624.37万 | -21.55% | 58.2% | 58.2% |
